文献类型：期刊文章

作　　者：高保娇[1] 高建峰[1] 蒋红梅[1] 张忠兴[1]

机构地区：[1]华北工学院化工系,太原030051

出　　处：《物理化学学报》

年　　份：2000

卷　　号：16

期　　号：4

起止页码：366-369

语　　种：中文

收录情况：AJ、BDHX、BDHX1996、CAS、CSCD、CSCD2011_2012、EBSCO、IC、INSPEC、JST、PUBMED、RCCSE、RSC、SCI-EXPANDED(收录号：WOS:000086650700014)、SCIE、SCOPUS、WOS、ZGKJHX、核心刊

摘　　要：The correlation of plating structure with the antioxygenation of micro Cu-Ag bimetallic powder was studied by SEM、XRD、TG and other means.It was found that copper powder plated with silver having an interspersion structure posesses antioxygenation at normal atmospheric temperature as surface Ag content reaches above 15.22%,the temperature of oxidation resistance varies with the surface Ag content.The greater the surface Ag content is,the higher the temperature of antioxygenation for bimetalic powder with the plating interspersion structure.The copper powder plated by silver with full packaging structure can not be oxidized even at

关 键 词：铜-银双金属粉  表层结构  抗氧化性 镀银铜粉

分 类 号：TQ15]